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迪斯科是一家总部位于日本的半导体制造设备制造商。该公司成立于1937年，主要生产金刚石切割刀片、水刀和激光切割机，以及研磨和抛光机。这些设备广泛应用于半导体制造的后端工艺——即对前端工艺中加工过的硅晶圆进行减薄和切割，将其切成裸芯片以供封装。迪斯科是全球最大的半导体级切割和抛光机制造商，截至2025年，在半导体切割和抛光领域占据约60%至70%的市场份额。该公司拥有三家主要工厂，均位于日本广岛县和长野县.

瑞萨电子是一家日本集成电路制造商，设计和制造微控制器及模拟芯片，其产品广泛应用于汽车、工业、企业和消费领域。公司总部位于东京，由NEC、三菱公司和日立旗下的电子业务部门合并而成。其业务主要集中在亚洲，历史上占总销售额的70%至80%。截至2024年，瑞萨分别是全球第三大和第九大的微控制器及功率/模拟器件制造商，市场份额分别为17%和3.5%.

NEC Corporation engages in information technology services, networks, social infrastructure, and solutions. The company operates through three business segments: information technology services, social infrastructure, and others. The information technology services segment provides system integration, consulting, maintenance, outsourcing, cloud services, system equipment, and software services. The social infrastructure segment covers network infrastructure, including core networks, mobile base stations, optical transmission systems, and marine systems, as well as telecommunications software, OSS/BSS solutions, aerospace and defense system integration, and maintenance. The other segment involves the development, manufacturing, and sales of system equipment. The company's revenue primarily comes from the information technology services segment.

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